Granted Patent
Utility
US 6,163,075 · App. 09/315,825
Multilayer wiring structure and semiconductor device having the same, and manufacturing method therefor
Inventor:
Mototsugu Okushima
Patented Case
View Patent ↗
Granted: Dec 19, 2000
Filed: May 21, 1999
Inventor
Mototsugu Okushima
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.