Granted Patent
Utility
US 6,164,522 · App. 09/384,892
Method of manufacturing a thick film circuit with constrained adhesive spreading
Inventors:
Frans Lautzenhiser, John K. Isenberg
Patented Case
View Patent ↗
Granted: Dec 26, 2000
Filed: Aug 27, 1999
Inventors
Frans Lautzenhiser
John K. Isenberg
Assignee (at issue)
Delphi Technologies
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.