Granted Patent
Utility
US 6,165,817 · App. 09/398,213
Method of bonding a flexible polymer tape to a substrate to reduce stresses on the electrical connections
Inventors:
Salman Akram, Warren M. Farnworth
Patented Case
View Patent ↗
Granted: Dec 26, 2000
Filed: Sep 17, 1999
Inventors
Salman Akram
Warren M. Farnworth
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.