Granted Patent
Utility
US 6,165,818 · App. 09/074,120
Method of manufacturing a semiconductor device with a pair of radiating terminals and a plurality of lead terminals formed from a single lead frame
Inventors:
Seiji Ichikawa, Takeshi Umemoto, Toshiaki Nishibe, Kazunari Sato, Kunihiko Tsubota, Masato Suga, Yoshikazu Nishimura, Keita Okahira, Tatsuya Miya, Toru Kitakoga, Kazuhiro Tahara
Patented Case
View Patent ↗
Granted: Dec 26, 2000
Filed: May 7, 1998
Inventors
Seiji Ichikawa
Takeshi Umemoto
Toshiaki Nishibe
Kazunari Sato
Kunihiko Tsubota
Masato Suga
Yoshikazu Nishimura
Keita Okahira
Tatsuya Miya
Toru Kitakoga
Kazuhiro Tahara
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.