Granted Patent
Utility
US 6,165,887 · App. 09/391,638
Method of improving interconnect of semiconductor devices by using a flattened ball bond
Inventor:
Michael Ball
Patented Case
View Patent ↗
Granted: Dec 26, 2000
Filed: Sep 7, 1999
Inventor
Michael Ball
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.