Granted Patent
Utility
US 6,165,895 · App. 09/344,865
Fabrication method of an interconnect
Inventor:
Jy-Hwang Lin
Patented Case
View Patent ↗
Granted: Dec 26, 2000
Filed: Jun 28, 1999
Inventor
Jy-Hwang Lin
Assignees (at issue)
United Semiconductor Corp.
WINBOND ELECTRONICS CORP.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.