Granted Patent
Utility
US 6,166,429 · App. 09/033,240
Lead-frame package with shield means between signal terminal electrodes
Inventors:
Hidetoshi Ishida, Kazuo Miyatsuji, Daisuke Ueda
Patented Case
View Patent ↗
Granted: Dec 26, 2000
Filed: Mar 3, 1998
Inventors
Hidetoshi Ishida
Kazuo Miyatsuji
Daisuke Ueda
Assignee (at issue)
Matsushita Electronics Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.