Granted Patent
Utility
US 6,168,070 · App. 09/172,047
Method for soldering DPAK-type electronic components to circuit boards
Inventor:
Peter Joseph Sinkunas
Patented Case
View Patent ↗
Granted: Jan 2, 2001
Filed: Oct 14, 1998
Inventor
Peter Joseph Sinkunas
Assignee (at issue)
Visteon Global Technologies, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.