Granted Patent
Utility
US 6,168,970 · App. 09/434,534
Ultra high density integrated circuit packages
Inventor:
Carmen D. Burns
Patented Case
View Patent ↗
Granted: Jan 2, 2001
Filed: Nov 5, 1999
Inventor
Carmen D. Burns
Assignee (at issue)
Staktek Group, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.