Granted Patent
Utility
US 6,169,028 · App. 09/237,787
Method fabricating metal interconnected structure
Inventors:
Kun-Chih Wang, Ming-Sheng Yang, Wen-Yi Hsieh
Patented Case
View Patent ↗
Granted: Jan 2, 2001
Filed: Jan 26, 1999
Inventors
Kun-Chih Wang
Ming-Sheng Yang
Wen-Yi Hsieh
Assignee (at issue)
WINBOND ELECTRONICS CORP.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.