Granted Patent
Utility
US 6,173,750 · App. 09/251,541
Method and apparatus for removing die from a wafer and conveying die to a pickup location
Inventors:
Peter Davis, Dean Tarrant
Patented Case
View Patent ↗
Granted: Jan 16, 2001
Filed: Feb 17, 1999
Inventors
Peter Davis
Dean Tarrant
Assignee (at issue)
Hover-Davis, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.