Granted Patent
Utility
US 6,174,789 · App. 09/250,164
Method of dividing a compound semiconductor wafer into pellets by utilizing extremely narrow scribe regions
Inventor:
Yasutoshi Tsukada
Patented Case
View Patent ↗
Granted: Jan 16, 2001
Filed: Feb 16, 1999
Inventor
Yasutoshi Tsukada
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.