Granted Patent
Utility
US 6,175,124 · App. 09/108,092
Method and apparatus for a wafer level system
Inventors:
Richard K. Cole, Scott J. Rittenhouse, Brad S. Tollerud, Matthew Von Thun, James P. Yakura
Patented Case
View Patent ↗
Granted: Jan 16, 2001
Filed: Jun 30, 1998
Inventors
Richard K. Cole
Scott J. Rittenhouse
Brad S. Tollerud
Matthew Von Thun
James P. Yakura
Assignee (at issue)
LSI Logic Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.