Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, simiconductor wafer polishing methods, and methods of forming polishing chucks

Granted: Jan 23, 2001 Filed: Mar 10, 1999

This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.