Granted Patent
Utility
US 6,180,187 · App. 09/469,479
Method of making an electronic component using reworkable underfill encapsulants
Inventors:
Bodan Ma, Quinn K. Tong, Chaodong Xiao
Patented Case
View Patent ↗
Granted: Jan 30, 2001
Filed: Dec 22, 1999
Inventors
Bodan Ma
Quinn K. Tong
Chaodong Xiao
Assignee (at issue)
National Starch and Chemical Investment Holding Copporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.