Granted Patent
Utility
US 6,180,265 · App. 09/216,769
Flip chip solder bump pad
Inventor:
Curt A Erickson
Patented Case
View Patent ↗
Granted: Jan 30, 2001
Filed: Dec 21, 1998
Inventor
Curt A Erickson
Assignee (at issue)
DELCO ELECTRONICS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.