Granted Patent
Utility
US 6,180,423 · App. 09/108,323
Method for wafer polishing and method for polishing pad dressing
Inventors:
Shin Hashimoto, Yoshiharu Hidaka
Patented Case
View Patent ↗
Granted: Jan 30, 2001
Filed: Jul 1, 1998
Inventors
Shin Hashimoto
Yoshiharu Hidaka
Assignee (at issue)
Matsushita Electronics Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.