Granted Patent
Utility
US 6,180,435 · App. 09/338,087
Semiconductor device with economical compact package and process for fabricating semiconductor device
Inventors:
Hiroshi Ise, Toshiaki Shironouchi
Patented Case
View Patent ↗
Granted: Jan 30, 2001
Filed: Jun 23, 1999
Inventors
Hiroshi Ise
Toshiaki Shironouchi
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.