Granted Patent
Utility
US 6,180,436 · App. 09/072,593
Method for removing heat from a flip chip semiconductor device
Inventors:
Mark A. Koors, Glen W Devos
Patented Case
View Patent ↗
Granted: Jan 30, 2001
Filed: May 4, 1998
Inventors
Mark A. Koors
Glen W Devos
Assignee (at issue)
DELCO ELECTRONICS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.