Granted Patent
Utility
US 6,184,073 · App. 08/997,714
Process for forming a semiconductor device having an interconnect or conductive film electrically insulated from a conductive member or region
Inventors:
Craig S. Lage, Mousumi Bhat, Yeong-Jyh T. Lii, Andrew G. Nagy, Larry E. Frisa, Stanley M. Filipiak, David L. O'Meara, T. P. Ong, Michael P. Woo, Terry G. Sparks, Carol M. Gelatos
Patented Case
View Patent ↗
Granted: Feb 6, 2001
Filed: Dec 23, 1997
Inventors
Craig S. Lage
Mousumi Bhat
Yeong-Jyh T. Lii
Andrew G. Nagy
Larry E. Frisa
Stanley M. Filipiak
David L. O'Meara
T. P. Ong
Michael P. Woo
Terry G. Sparks
Carol M. Gelatos
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.