Granted Patent
Utility
US 6,184,581 · App. 08/977,525
Solder bump input/output pad for a surface mount circuit device
Inventors:
Ralph Edward Cornell, Aparna Vaidyanthan, Curt A Erickson
Patented Case
View Patent ↗
Granted: Feb 6, 2001
Filed: Nov 24, 1997
Inventors
Ralph Edward Cornell
Aparna Vaidyanthan
Curt A Erickson
Assignee (at issue)
DELCO ELECTRONICS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.