Granted Patent
Utility
US 6,184,584 · App. 09/291,872
Miniaturized contact in semiconductor substrate and method for forming the same
Inventor:
Masato Sakao
Patented Case
View Patent ↗
Granted: Feb 6, 2001
Filed: Apr 14, 1999
Inventor
Masato Sakao
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.