Granted Patent
Utility
US 6,184,587 · App. 08/735,815
Resilient contact structures, electronic interconnection component, and method of mounting resilient contact structures to electronic components
Inventors:
Igor Y. Khandros, Gaetar L. Mathieu
Patented Case
View Patent ↗
Granted: Feb 6, 2001
Filed: Oct 21, 1996
Inventors
Igor Y. Khandros
Gaetar L. Mathieu
Assignee (at issue)
FormFactor, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.