Granted Patent
Utility
US 6,186,316 · App. 09/331,099
Method and device for the precise electrolytic deposition and etching of metal layers on circuit boards and conductors foils in continuous systems
Inventor:
Jacques Denis
Patented Case
View Patent ↗
Granted: Feb 13, 2001
Filed: Jun 16, 1999
Inventor
Jacques Denis
Assignee (at issue)
Atotech Deutschland GmbH
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.