Granted Patent
Utility
US 6,187,613 · App. 09/434,854
Process for underfill encapsulating flip chip driven by pressure
Inventors:
Chin-Yung Wu, Tay-Yuan Chen
Patented Case
View Patent ↗
Granted: Feb 13, 2001
Filed: Nov 4, 1999
Inventors
Chin-Yung Wu
Tay-Yuan Chen
Assignee (at issue)
Industrial Technology Research Institute
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.