Granted Patent
Utility
US 6,188,129 · App. 09/046,136
Stacked semiconductor chip package having external terminal pads and stackable chips having a protection layer
Inventors:
Kyung Wook Paik, Jin Su Kim, Hyoung-soo Ko
Patented Case
View Patent ↗
Granted: Feb 13, 2001
Filed: Mar 23, 1998
Inventors
Kyung Wook Paik
Jin Su Kim
Hyoung-soo Ko
Assignee (at issue)
Hyundai Electronics Industries Co. Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.