Granted Patent
Utility
US 6,190,939 · App. 09/115,293
Method of manufacturing a warp resistant thermally conductive circuit package
Inventor:
Carmen D. Burns
Patented Case
View Patent ↗
Granted: Feb 20, 2001
Filed: Jul 14, 1998
Inventor
Carmen D. Burns
Assignee (at issue)
Staktek Group, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.