Granted Patent
Utility
US 6,190,944 · App. 09/314,010
Stacked package for semiconductor device and fabrication method thereof, and apparatus for making the stacked package
Inventor:
Chang Kuk Choi
Patented Case
View Patent ↗
Granted: Feb 20, 2001
Filed: May 19, 1999
Inventor
Chang Kuk Choi
Assignee (at issue)
Hyundai Electronics Industries Co. Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.