Granted Patent
Utility
US 6,196,445 · App. 09/208,279
Method for positioning the bond head in a wire bonding machine
Inventors:
Rich Fogal, Michael B. Ball
Patented Case
View Patent ↗
Granted: Mar 6, 2001
Filed: Dec 8, 1998
Inventors
Rich Fogal
Michael B. Ball
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.