Granted Patent
Utility
US 6,201,294 · App. 08/985,959
Ball grid array semiconductor package comprised of two lead frames
Inventor:
Ju-Hwa Lee
Patented Case
View Patent ↗
Granted: Mar 13, 2001
Filed: Dec 5, 1997
Inventor
Ju-Hwa Lee
Assignee (at issue)
Hyundai Electronics Industries Co. Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.