Granted Patent
Utility
US 6,201,301 · App. 09/010,414
Low cost thermally enhanced flip chip BGA
Inventor:
Lan H. Hoang
Patented Case
View Patent ↗
Granted: Mar 13, 2001
Filed: Jan 21, 1998
Inventor
Lan H. Hoang
Assignee (at issue)
LSI Logic Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.