Granted Patent
Utility
US 6,201,305 · App. 09/591,705
Making solder ball mounting pads on substrates
Inventors:
Robert Francis Darveaux, Barry M. Miles, Alexander William Copia
Patented Case
View Patent ↗
Granted: Mar 13, 2001
Filed: Jun 9, 2000
Inventors
Robert Francis Darveaux
Barry M. Miles
Alexander William Copia
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.