Granted Patent
Utility
US 6,203,929 · App. 09/294,264
Gold plated solder material and method of fluxless soldering using solder
Inventor:
Heinrich Muller
Patented Case
View Patent ↗
Granted: Mar 20, 2001
Filed: Apr 19, 1999
Inventor
Heinrich Muller
Assignee (at issue)
TRW Limited
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.