Granted Patent
Utility
US 6,207,547 · App. 09/305,766
Bond pad design for integrated circuits
Inventors:
Sailesh Chittipeddi, Vivian W. Ryan
Patented Case
View Patent ↗
Granted: Mar 27, 2001
Filed: May 5, 1999
Inventors
Sailesh Chittipeddi
Vivian W. Ryan
Assignee (at issue)
LUCENT TECHNOLOGIES INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.