Granted Patent
Utility
US 6,207,551 · App. 09/382,003
Method and apparatus using formic acid vapor as reducing agent for copper wirebonding
Inventors:
Surasit Chungpaiboonpatana, Craig Davidson
Patented Case
View Patent ↗
Granted: Mar 27, 2001
Filed: Aug 24, 1999
Inventors
Surasit Chungpaiboonpatana
Craig Davidson
Assignee (at issue)
Conexant Systems, LLC
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.