IP Library Granted Patent US 6,207,584
Granted Patent Utility
US 6,207,584 · App. 09/478,270

High dielectric constant material deposition to achieve high capacitance

Inventors: Hua Shen, David E. Kotecki, Robert Benjamin Laibowitz, Katherine L. Saenger, Satish D. Athavale, Jenny Lian, Martin Gutsche, Yun-Yu Wang, Thomas Shaw
Patented Case View Patent ↗
Granted: Mar 27, 2001 Filed: Jan 5, 2000
Inventors
Hua Shen
David E. Kotecki
Robert Benjamin Laibowitz
Katherine L. Saenger
Satish D. Athavale
Jenny Lian
Martin Gutsche
Yun-Yu Wang
Thomas Shaw
Assignees (at issue)
International Business Machines Corporation
Infineon Technologies North America Corp.

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Quick Facts
Patent No.
US 6,207,584
App. No.
09/478,270
Filed
2000-01-05
Granted
2001-03-27
Kind
A