Granted Patent
Utility
US 6,208,016 · App. 09/256,124
Forming submicron integrated-circuit wiring from gold, silver, copper and other metals
Inventor:
Paul A. Farrar
Patented Case
View Patent ↗
Granted: Mar 27, 2001
Filed: Feb 24, 1999
Inventor
Paul A. Farrar
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.