Granted Patent
Utility
US 6,208,020 · App. 09/432,216
Leadframe for use in manufacturing a resin-molded semiconductor device
Inventors:
Masanori Minamio, Kunikazu Takemura, Yuichiro Yamada, Fumito Ito, Takahiro Matsuo
Patented Case
View Patent ↗
Granted: Mar 27, 2001
Filed: Nov 3, 1999
Inventors
Masanori Minamio
Kunikazu Takemura
Yuichiro Yamada
Fumito Ito
Takahiro Matsuo
Assignee (at issue)
Matsushita Electronics Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.