Granted Patent
Utility
US 6,208,155 · App. 09/014,100
Probe tip and method for making electrical contact with a solder ball contact of an integrated circuit device
Inventors:
Nasser Barabi, Siamak Jonaidi
Patented Case
View Patent ↗
Granted: Mar 27, 2001
Filed: Jan 27, 1998
Inventors
Nasser Barabi
Siamak Jonaidi
Assignee (at issue)
Cerprobe Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.