Granted Patent
Utility
US 6,214,722 · App. 09/286,005
Method for improving wafer topography to provide more accurate transfer of interconnect patterns
Inventors:
Chien-Chih Lin, Bill Hsu, Nien-Tsu Peng
Patented Case
View Patent ↗
Granted: Apr 10, 2001
Filed: Apr 5, 1999
Inventors
Chien-Chih Lin
Bill Hsu
Nien-Tsu Peng
Assignee (at issue)
WINBOND ELECTRONICS CORP.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.