Granted Patent
Utility
US 6,221,682 · App. 09/321,565
Method and apparatus for evaluating a known good die using both wire bond and flip-chip interconnects
Inventors:
Steve M Danziger, Tushar K. Shah
Patented Case
View Patent ↗
Granted: Apr 24, 2001
Filed: May 28, 1999
Inventors
Steve M Danziger
Tushar K. Shah
Assignee (at issue)
LOCKHEED MARTIN CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.