Granted Patent
Utility
US 6,221,978 · App. 09/288,899
Moisture curable hot melt adhesive and method for bonding substrates using same
Inventors:
Yingjie Li, Reimar Heucher, John T. Cain
Patented Case
View Patent ↗
Granted: Apr 24, 2001
Filed: Apr 9, 1999
Inventors
Yingjie Li
Reimar Heucher
John T. Cain
Assignee (at issue)
Henkel Limited
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.