Granted Patent
Utility
US 6,222,255 · App. 09/428,073
Method of creating an interconnect in a substrate and semiconductor device employing the same
Inventor:
Jaeheon Han
Patented Case
View Patent ↗
Granted: Apr 24, 2001
Filed: Oct 27, 1999
Inventor
Jaeheon Han
Assignee (at issue)
LUCENT TECHNOLOGIES INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.