Granted Patent
Utility
US 6,223,973 · App. 09/441,334
Apparatus and method for connecting printed circuit boards through soldered lap joints
Inventors:
Stephen H. P. Wong, Billy Kiang
Patented Case
View Patent ↗
Granted: May 1, 2001
Filed: Nov 16, 1999
Inventors
Stephen H. P. Wong
Billy Kiang
Assignee (at issue)
Visteon Global Technologies, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.