Granted Patent
Utility
US 6,227,944 · App. 09/276,278
Method for processing a semiconductor wafer
Inventors:
Yun-Biao Xin, Ichiro Yoshimura, Henry F. Erk, Ralph V. Vogelgesang, Stephen Hensiek
Patented Case
View Patent ↗
Granted: May 8, 2001
Filed: Mar 25, 1999
Inventors
Yun-Biao Xin
Ichiro Yoshimura
Henry F. Erk
Ralph V. Vogelgesang
Stephen Hensiek
Assignee (at issue)
MEMC Electronic Materials, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.