Granted Patent
Utility
US 6,229,210 · App. 09/206,197
Device and method for attaching and soldering pre-formed solder spheres to the ball grid array (BGA) integrated circuit package attachment sites in high volume
Inventor:
William J. Casey
Patented Case
View Patent ↗
Granted: May 8, 2001
Filed: Dec 4, 1998
Inventor
William J. Casey
Assignee (at issue)
MCMS Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.