Granted Patent
Utility
US 6,229,218 · App. 09/187,477
Interconnect device and method for mating dissimilar electronic package footprints
Inventors:
William J. Casey, Andrew J. Heidelberg, Daniel C. Skinner
Patented Case
View Patent ↗
Granted: May 8, 2001
Filed: Nov 6, 1998
Inventors
William J. Casey
Andrew J. Heidelberg
Daniel C. Skinner
Assignee (at issue)
MCMS Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.