Granted Patent
Utility
US 6,232,153 · App. 09/090,575
Plastic package assembly method for a ferroelectric-based integrated circuit
Inventors:
Sanjay Mitra, Vic Lau
Patented Case
View Patent ↗
Granted: May 15, 2001
Filed: Jun 4, 1998
Inventors
Sanjay Mitra
Vic Lau
Assignee (at issue)
RAMTRON INTERNATIONAL CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.