IP Library Granted Patent US 6,232,563
Granted Patent Utility
US 6,232,563 · App. 08/755,142

Bump electrode and method for fabricating the same

Inventors: Seong Jin Kim, Young Sang Baek
Patented Case View Patent ↗
Granted: May 15, 2001 Filed: Nov 22, 1996
Inventors
Seong Jin Kim
Young Sang Baek
Assignee (at issue)
LG ELECTRONICS INC.

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Quick Facts
Patent No.
US 6,232,563
App. No.
08/755,142
Filed
1996-11-22
Granted
2001-05-15
Kind
A