Granted Patent
Utility
US 6,233,046 · App. 09/343,207
Method of measuring the thickness of a layer of silicon damaged by plasma etching
Inventors:
Simone Alba, Claudio Alfonso Giacomo Savoia, Enrico Bellandi, Francesca Canali
Patented Case
View Patent ↗
Granted: May 15, 2001
Filed: Jun 29, 1999
Inventors
Simone Alba
Claudio Alfonso Giacomo Savoia
Enrico Bellandi
Francesca Canali
Assignee (at issue)
STMICROELECTRONICS S.r.l.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.